XP2200 PCIe BGA SSD

FORESEE's first self-developed PCIe Gen4*2 BGA SSD
Product Advantages

FORESEE's first self-developed PCIe Gen4*2 BGA SSD for more lightweight mobile smart terminals
Advanced process technology with new heat-dissipation materials and software technologies to optimize heat dissipation
Cutting-edge packaging and testing techniques enable high-rises tacking technology

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Product Parameter
Product Series PN NAND Flash Capacity Type DRAM Operating Temperature Sequential Read Speed* Sequential Write Speed* Random Read Speed (IOPS)* Random Write Speed (IOPS)* Mean Time Between Failures (Hour) Size
XP2200 PCIe BGA SSD FM2A9C128G-E8Y18 3D TLC 128GB BGA DRAM-less 0℃~70°C 1700MB/s 1000MB/s 192K 220K 1.5 million hours 11.5*13 mm
XP2200 PCIe BGA SSD FM2A9C256G-E8Y18 3D TLC 256GB BGA DRAM-less 0℃~70°C 3400MB/s 2200MB/s 250K 210K 1.5 million hours 11.5*13 mm
XP2200 PCIe BGA SSD FM2A9C512G-E8Y18 3D TLC 512GB BGA DRAM-less 0℃~70°C 3500MB/s 3400MB/s 260K 210K 1.5 million hours 11.5*13 mm
XP2200 PCIe BGA SSD FM2A9C001T-E8Y18 3D TLC 1TB BGA DRAM-less 0℃~70°C 3500MB/s 3450MB/s 260K 220K 1.5 million hours 11.5*13 mm
TRIM and S.M.A.R.T functions are supported.
* Indicates the maximum read/write performance
* Data is sourced from intern testing of Longsys. The actual performance may vary between different devices.
Product Features
  • 01
    Advanced process technology to optimize heat dissipation

  • 02
    Cutting-edge packaging and testing techniques enable high-rises tacking technology.

  • 03
    Self-developed firmware algorithm, support LDPC, intelligent temperature control and other functions

  • 04
    Supports NVMe 1.4 protocol

  • 05
    Available in BGA form factor with ultimate thickness up to 1.35mm (max)

Application
  • Laptop

  • 2-in-one Computer

  • Automotive Electronics

  • Gaming Devices