About Longsys

1999

Shenzhen Longsys Electronics Co., Ltd. was established and engaged in MASK ROM services.

2002

Took the lead in releasing the USB control chip based on AG-AND flash memory, providing high compatibility and cost-effective storage solutions in China.

2006

R&D, production and sales of SD cards and MMC mobile flash memory cards.

2007

Passed ISO9001:2000 quality system certification.

2008

Took the lead in releasing the USB flash module UDP, changing the production and business models of the USB flash memory industry.

2009

Took the lead in using TLC NAND Flash to produce storage products in China.
Used the 16-layer stacking technology in production of 32GB microSDs.

2011

Created the high-end embedded storage brand FORESEE and released eMMC and SSD storage products.
Obtained technical authorization from Oracle and created the Oracle ERP system suitable for the storage market, promoting digital operations of Longsys.

2012

Took the lead in releasing the TSOP 48 packaged SD protocol product

2013

Released Longsys's first TLC eMMC, and took the lead to achieve mass production in China.

2014

Officially launched the English name "Longsys" and started global development.

2015

Qualified as a "Designated Production Unit for Commercial Encryption Products".
Commodified the DRAM technology and released LPDDR3 and eMCP embedded storage products.

2016

Took the lead in releasing the integrated SSD module product SATA disk in package (SDP), motivating industrial innovation.
Entrusted Ernst & Young as Longsys auditor for compliance management based on international standards.

2017

Acquired Lexar, an international high-end consumer storage brand, which became a wholly-owned subsidiary of Longsys to operate independently.
Won the “Chinese Patent Excellence Award”.
Passed IPR management system certification.

2018

Completed the joint-stock system reform.
Took the lead in releasing the 1TB UFS, 1TB microSD card, and 1TB PCIe BGA SSD, leading the memory industry to enter the TB-level capacity era.

2019

The first phase of Longsys Zhongshan Storage Industrial Park was completed and put it into use.
The first series A round of funding was completed, about US $230 million.

2020

Entered the memory module market and provided consumer-grade, commercial-grade, and enterprise-grade memory module products.
Took the lead in releasing automotive eMMC in mainland China, which complies with the AEC-Q100 standard.
Planned to establish the Shanghai Headquarter and Shanghai R&D Center in Lin-gang Special Area of China (Shanghai).
The annual sales exceeded US $1 billion for the first time ever.

2021

Longsys Shanghai headquarter broke ground in the Lin-gang Special Area of China (Shanghai) Pilot Free Trade Zone, which will be opened in 2024.

2022

Listed on the Shenzhen Stock Exchange (301308.SZ) on August 5.
Took the lead in releasing automotive UFS and 512Mb SPI NAND Flash in mainland China.

2023

The second phase of Longsys Zhongshan Storage Industrial Park topped out, expanding high-end storage testing capacity.
Longsys Shanghai headquarter topped out, building a high-end storage R&D complex.
The annual sales exceeded US $1.38 billion, and the sales revenue for the third quarter reached a record high of US $400 million.
Successfully acquired a 70% equity stake in Longforce Suzhou(formerly Powertech Technology Suzhou), strengthening the industry chain layout.
Successfully acquired a 81% equity stake in Zilia Technologies (formerly SMART Brazil), focusing on the Brazilian market.
Wisemem made a breakthrough in its in-house memory controller with industry-leading performance.
Released enterprise SSD and DDR5 RDIMM, taking the first step in the field of high-end storage products.

2024

Announced TCM (Technology Contract Manufacturing) Business Model, providing one-stop storage product solutions and service.
Took the lead in releasing QLC eMMC and 1TB NM Card in mainland China.
Released LPCAMM2 new form-factor memory and CXL 2.0 memory expansion module.
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