2002
AND Flash USB
Took the lead in releasing USB flash memory control chip based on AG-AND flash memory with customized USB controller inside.
2006
MMC mobile
Designed power IC to apply single-voltage flash to dual-voltage MMC mobile products.
2008
UDP Module
Took the lead in releasing globally the USB flash module UDP, revolutionizing the production and business model of the USB flash memory industry.
2009
NFC microSD
Took the lead in releasing the memory card that supports NFC (Near Field Communication) function and obtained UnionPay PCI DSS certification.
2010
EUDM
Developed the first USB protocol embedded memory product at the time.
2011
Wi-Fi microSD
Released the microSD of mobile phones that supports Wi-Fi(Wireless Fidelity) function, making wireless transmission possible.
2012
tSD
Took the lead in releasing the TSOP 48 packaged SD protocol product, which was recognized as the "National Key New Product" by the Ministry of Science and Technology.
2014
eMCP
Released eMCP, the embedded memory chip that combines eMMC and LPDDR3.
2015
Type-C USB3.1
Took the lead in releasing the Type-C USB 3.1 with high-speed U3 products.
2015
iOS USB Flash Drive
Took the lead in releasing the NAND Flash-based USB flash drive that supports Apple iOS.
2016
Mini SDP
Took the lead in releasing globally the integrated SSD module product SATA Disk in Package (SDP), motivating industry innovation.
2017
PCIe BGA SSD
On July 14th, the world's smallest SSD (at the time) was released, measuring size was only 11.5mm x 13mm.
2019
Industrial wide-temperature eMMC
Released Industrial Wide-Temperature eMMC, which is available in 8GB-64GB capacities, with operating temperature from -40 to 85°C, and in full-scale mass production.
2020
Automotive eMMC
Took the lead in releasing the automotive-grade eMMC in mainland China, which complies with AEC-Q100 standards.
2021
DDR5 UDIMM
Released DDR5 UDIMM with a maximum speed of up to 6400Mbps. The first to introduce testing technology and to make multiple test data publicly available.
2022
SPI NAND Flash
Took the lead in releasing the 512Mb SPI NAND Flash in mainland China, wholly self-developed by Longsys.
2022
Automotive UFS
Took the lead in releasing automotive-grade UFS in mainland China, which the operating temperature range is -40℃ to 105℃ (Grade 2).
2023
Enterprise-grade SSD
Released FORESEE's first enterprise-grade SSD, covering PCIe and SATA interfaces.
2023
Enterprise-grade DDR5 RDIMM
Released FORESEE's first enterprise-grade DDR5 RDIMM, which is available in 32GB/64GB/96GB capacities, and already in mass production.
2023
WiseMem Memory Controller(WM6000 and WM5000)
WiseMem released Memory Controller(WM6000 and WM5000), which adopted in-house LDPC algorithm with industry-leading performance.
2009
NBOX Multimedia Player
Developed the smallest NBOX multimedia player at the time.
2024
QLC eMMC
Took the lead in releasing the QLC eMMC, which capacity is up to 512GB.
2024
LPCAMM2
Released LPCAMM2 new form-factor memory, with unique 128 bit wide design, which breaks through in volume, energy efficiency and power consumption.
2024
CXL 2.0 Memory Expansion Module
Released FORESEE's first CXL 2.0 Memory Expansion Module with self-developed architecture design, supporting memory pooling shared to bring a new breakthrough for enterprise applications.