mSSD

Office is Factory： Flexible Manufacturing & Assembly Innovating the SSD Form Factor
Product Advantages

Cost Reduction & Efficiency Improvement
Chip-level Quality
Efficient Heat Dissipation, Innovative Thermal Design
Flexible Scalability
High Performance & High Reliability

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Product Parameter
Product Series Interface Form Factor Flash Type Capacity Sequential Read Speed* Sequential Write Speed* Random Read Speed (IOPS)* Random Write Speed (IOPS)* L1.2 Mode Max. Channels DRAM Size MTBF Operation Temperature Data retention
mSSD PCIe Gen4×4 PCIe design in package( Expandable M.2 2280 / M.2 2242 / M.2 2230 ) TLC / QLC 512GB 7400MB/s 6500MB/s 820K 1000K ≤3.5mW 4 DRAM-less 30×20 mm 200 million hours 0℃ ~ 70℃ 200 TBW
mSSD PCIe Gen4×4 PCIe design in package( Expandable M.2 2280 / M.2 2242 / M.2 2230 ) TLC / QLC 1TB 7400MB/s 6500MB/s 820K 1000K ≤3.5mW 4 DRAM-less 30×20 mm 200 million hours 0℃ ~ 70℃ 400 TBW
mSSD PCIe Gen4×4 PCIe design in package( Expandable M.2 2280 / M.2 2242 / M.2 2230 ) TLC / QLC 2TB 7400MB/s 6500MB/s 820K 1000K ≤3.5mW 4 DRAM-less 30×20 mm 200 million hours 0℃ ~ 70℃ 800 TBW
mSSD PCIe Gen4×4 PCIe design in package( Expandable M.2 2280 / M.2 2242 / M.2 2230 ) TLC / QLC 4TB 7400MB/s 6500MB/s 820K 1000K ≤3.5mW 4 DRAM-less 30×20 mm 200 million hours 0℃ ~ 70℃ 1600 TBW
*The data comes from Longsys's internal test. The actual performance may vary due to equipment differences.
Product Features
  • 01
    Wafer-level system-in-package (SiP)

  • 02
    The mSSD integrates all steps into a single packaging process — eliminating PCB mounting, reflow soldering, and multiple logistics transfers.

  • 03
    Delivery efficiency doubled

  • 04
    Product quality improved tenfold

  • 05
    Additional costs reduced by more than 10%

  • 06
    Efficient Heat Dissipation, Innovative Thermal Design

  • 07
    An optional clip-on thermal expansion card allows tool-free conversion between mainstream form factors such as M.2 2230, 2242, and 2280, enabling multiple SKUs in one

Application

  • AI PC

  • Ultrabooks

  • All-in-one Desktops

  • Drones

  • Handheld Gaming Devices

  • VR Devices

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