Industrial DDR4 DIMM

Allows for safe, reliable, and durable solutions for harsher fields of application
Product Advantages

Developed with quality hardware and materials at Longsys Zhongshan Storage Industrial Park
Characterized by stability and reliability in various extreme environments

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Product Parameter
Product Series PN Capacity Interface Architecture Data Rate CL Value Timing Clock Operating Voltage Gold Fingers (Edge Connectors) Operating Temperature Size ECC
F4SN F4SNW-4GHE32B000 4GB DDR4 SODIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNW-8GHE32A000 8GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNW-QGHC32A000 16GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNW-RGHC32C000 32GB DDR4 SODIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNM-4GHE32B000 4GB DDR4 SODIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNM-8GHE32A000 8GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNM-QGHC32A000 16GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNM-RGHC32C000 32GB DDR4 SODIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNS-4GHE32B000 4GB DDR4 SODIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNS-8GHE32A000 8GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNS-QGHC32A000 16GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm without ECC
F4SN F4SNS-RGHC32C000 32GB DDR4 SODIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm without ECC
F4SE F4SES-8GHE32A000 8GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm with ECC
F4SE F4SES-QGHC32A000 16GB DDR4 SODIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm with ECC
F4SE F4SES-RGHC32C000 32GB DDR4 SODIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 69.60*30.00 mm with ECC
F4UN F4UNW-4GHE32B000 4GB DDR4 UDIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNW-8GHE32A000 8GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNW-QGHD32A000 16GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNW-RGHD32C000 32GB DDR4 UDIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -40℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNM-4GHE32B000 4GB DDR4 UDIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNM-8GHE32A000 8GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNM-QGHD32A000 16GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNM-RGHD32C000 32GB DDR4 UDIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” -25℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNS-4GHE32B000 4GB DDR4 UDIMM 1R×16 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNS-8GHE32A000 8GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNS-QGHD32A000 16GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm without ECC
F4UN F4UNS-RGHD32C000 32GB DDR4 UDIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm without ECC
F4UE F4UES-8GHE32A000 8GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm with ECC
F4UE F4UES-QGHD32A000 16GB DDR4 UDIMM 1R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm with ECC
F4UE F4UES-RGHD32C000 32GB DDR4 UDIMM 2R×8 3200Mbps 22 22-22-22 1600MHz 1.2V 30μ” 0℃~85℃ 133.35*31.25 mm with ECC
*The data comes from Longsys’s internal test. The actual performance may vary due to equipment differences.
Product Features
  • 01
    -40℃~85℃ wide temperature severe selection of particles with extended temperature function

  • 02
    X6S+ MCLL

  • 03
    30u" Gold finger plating thickness

  • 04
    PCB design, rigidity TG 150+，ECC correction

  • 05
    EIA-364-65B anti-sulfuration material/coating (special specification)

Application

  • Desktop

  • All-in-one machine

  • Laptops

  • Industrial automation

  • Industrial PC

  • Intelligent government terminal

  • Government affairs Office System

  • Medical equipment

  • rail traffic system

  • Electric power equipment

Compatible Platforms

Number

Platform

01

Intel

02

AMD

（The product supports mainstream platforms and only part of it is shown here.）

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