NAND-based MCP

Stacked packaging of Flash and LPDDR, saving PCB space

Product Advantages

Stacked packaging of Flash and LPDDR simplifies cabling design and saves PCB space.
A core voltage of 1.8V meets the low power consumption requirement of wearable devices and the Internet of Things (IoT).
The product integrates DDR and NAND, which helps customers reduce the number of components to be purchased in the BOM, simplify purchase, and reduce costs.

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Product Parameter

Product Series	NAND Flash	Capacity	Package	Page Size	Operating Temperature	Voltage	Size	Rank Per Channel	P/N
LPDDR2 NAND-based MCP	SLC NAND	1Gbit+1Gbit	FBGA162	2K Page	-40~85℃	NAND: 1.7~1.95V LPDDR2: 1.14~1.30V	8*10.5mm	1	F70ME0101F-RWT
LPDDR2 NAND-based MCP	SLC NAND	2Gbit+1Gbit	FBGA162	2K Page	-40~85℃	NAND: 1.7~1.95V LPDDR2: 1.14~1.30V	8*10.5mm	1	F70ME0201F-RWT
LPDDR2 NAND-based MCP	SLC NAND	2Gbit+2Gbit	FBGA162	2K Page	-40~85℃	NAND: 1.7~1.95V LPDDR2: 1.14~1.30V	8*10.5mm	1	F70ME0202A-RWT
LPDDR2 NAND-based MCP	SLC NAND	4Gbit+2Gbit	FBGA162	4K Page	-40~85℃	NAND: 1.7~1.95V LPDDR2: 1.14~1.30V	8*10.5mm	1	F70ME0402A-RWT
LPDDR4x NAND-based MCP	SLC NAND	4Gbit+6Gbit	WFBGA149	4K Page	-40~85℃	NAND: 1.7~1.95V LPDDR4x: 1.06~1.17V	8*9.5mm	1	F70NH0406A-SWT
LPDDR4x NAND-based MCP	SLC NAND	4Gbit+8Gbit	WFBGA149	4K Page	-40~85℃	NAND: 1.7~1.95V LPDDR4x: 1.06~1.17V	8*9.5mm	1	F70NH0408A-SWT
LPDDR4x NAND-based MCP	SLC NAND	8Gbit+6Gbit	WFBGA149	4K Page	-40~85℃	NAND: 1.7~1.95V LPDDR4x: 1.06~1.17V	8*9.5mm	1	F70NH0806A-SWT
LPDDR4x NAND-based MCP	SLC NAND	8Gbit+8Gbit	WFBGA149	4K Page	-40~85℃	NAND: 1.7~1.95V LPDDR4x: 1.06~1.17V	8*9.5mm	1	F70NH0808A-SWT

*The data comes from Longsys’s internal test. The actual performance may vary due to equipment differences.

Product Features

01
SLC NAND and LPDDR 2 utilize multi-chip packaging.
02
The operating voltage can be 1.8V or 1.2V and complies with mainstream product standards.
03
Capacity combinations meet various capacity requirements.
04
BGA162 packaging helps save the PCB space.