Subsize eMMC

Innovative eMMC with a smaller size and lower power consumption
Product Advantages

The product is compact and requires less PCB space.
The product complies with JEDEC pin standards.

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Product Parameter
Product Series NAND Flash Capacity Package Operating Temperature Protocol Interface Operating Voltage Size
Subsize eMMC MLC 4GB 153Ball -25℃~85℃ eMMC 5.1 HS400 3.3V/1.8V 9*7.5*0.8mm
Subsize eMMC MLC 8GB 153Ball -25℃~85℃ eMMC 5.1 HS400 3.3V/1.8V 9*7.5*0.8mm
Subsize eMMC TLC 32GB 153Ball -25℃~85℃ eMMC 5.1 HS400 3.3V/1.8V 9*10*0.8mm
Subsize eMMC TLC 64GB 153Ball -25℃~85℃ eMMC 5.1 HS400 3.3V/1.8V 7.2*7.2*0.8mm
Subsize eMMC TLC 128GB 153Ball -25℃~85℃ eMMC 5.1 HS400 3.3V/1.8V 7.2*7.2*0.8mm
*The data comes from Longsys’s internal test. The actual performance may vary due to equipment differences.
Product Features
  • 01
    The product is downward compatible with standard industry protocols and is small and thin.

  • 02
    When compared with the eMMC with a standard size, the FORESEE subsize eMMC can save 40% to 55% PCB space.

  • 03
    Based on insights to Flash and application scenarios, the FORESEE subsize eMMC further reduces power consumption.

  • 04
    The product is suitable for application scenarios with limited space, such as wearable devices.

Application

  • Smart watch

  • Smart band

  • Smart earphone

  • Industrial IPC

Compatible Platforms

Number

Platform

01

Qualcomm

（The product supports mainstream platforms and only part of it is shown here.）

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