ePOP
ePOP

ePOP

Small size, low power consumption, and born for smart wearable devices
Product Advantages

The product is highly integrated and compact, saving PCB space.
The low-power design helps wearable devices extend their standby time.
The product provides various capacity combinations, such as 8GB+4Gb and 8GB+8Gb.

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Product Parameter
Product Series Protocol Capacity DRAM Frequency Package Operating Temperature Size Operating Voltage
ePOP3 eMMC5.1+LPDDR3 8GB+8Gb 800MHz 136ball -25℃~85℃ 10*10*0.9 mm DRAM:VDD1=VDD2=1.8V;VDDQ=1.2V
eMMC: VCC:2.7~3.6V;VCCQ:1.7~1.95V/2.7~3.6V
ePOP3 eMMC5.1+LPDDR3 32GB+8Gb 800MHz 136ball -25℃~85℃ 10*10*0.9 mm DRAM:VDD1=VDD2=1.8V;VDDQ=1.2V
eMMC:VCC:2.7~3.6V;VCCQ:1.7~1.95V/2.7~3.6V
ePOP3 eMMC5.1+LPDDR3 64GB+8Gb 800MHz 136ball -25℃~85℃ 10*10*0.9 mm DRAM:VDD1=VDD2=1.8V;VDDQ=1.2V
eMMC:VCC:2.7~3.6V;VCCQ:1.7~1.95V/2.7~3.6V
ePOP4x eMMC5.1+LPDDR4x 32GB+16Gb 2133MHz 144ball -25℃~85℃ 8*9.5*0.8 mm DRAM:VDD1=1.8V;VDD2=1.1V;VDDQ=0.6V
eMMC:VCC:2.7~3.6V;VCCQ:1.7~1.95V/2.7~3.6V
ePOP4x eMMC5.1+LPDDR4x 64GB+16Gb 2133MHz 144ball -25℃~85℃ 8*9.5*0.6 mm DRAM:VDD1=1.8V;VDD2=1.1V;VDDQ=0.6V
eMMC:VCC:2.7~3.6V;VCCQ:1.7~1.95V/2.7~3.6V
*The data comes from Longsys’s internal test. The actual performance may vary due to equipment differences.
Product Features
  • 01
    The product has passed compatibility verification of multiple platforms.

  • 02
    It supports field firmware update (FFU).

  • 03
    Maximum thickness of just 0.6mm

Application

  • Smart watch

  • Smart band

  • Smart earphone

Compatible Platforms

Number

Platform

01

Qualcomm

（The product supports mainstream platforms and only part of it is shown here.）


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