EMMC is an abbreviation for Embedded MultiMedia Card, and eMCP is an abbreviation for Embedded MultiChip Packages. As the name implies, eMMC includes NAND (memory) as well as an MMC IC controller. NAND, an MWC controller IC, and DRAM are also included in the eMCP.
Low-Power Double Data Rate (LPDDR) DRAM and Embedded MultiMedia Card (e•MMC) storage are combined into a single, compact Multi-Chip Package (MCP) by eMCP. Since eMMC and low-power DRAM are combined into one package, the eMCP is highly integrated, which benefits new product development by speeding up the process, streamlining PCB design, and cutting costs. The overall size is decreased while this approach offers greater integration. For systems with limited space, such as mobile phones, tablets, wearables, and various "Internet of Things" (IoT) devices, eMCP is the perfect combined storage and memory component.
A phone with eMCP memory has a substantially lower inter-component delay and hence consumes less power. A phone with an eMPC will have a dedicated RAM module with a slightly higher inter-chip delay. A smartphone with an eMCP chipset has a smaller motherboard, whereas a phone with an eMMC chipset has a somewhat larger motherboard due to the presence of a separate RAM module. In a nutshell, an eMCP is an eMMC with a low-power memory on a single chip.
NAND flash memory, the same material found in USB thumb drives, SD cards, and solid-state drives (SSD), is what makes up eMCP storage. NAND flash memory doesn't need the power to store data.
The current eMCP storage standard is v5.1A, which can effectively achieve transfer rates of up to 400MB/s.
• Operating temperature
-25 c to 85 c
• Package –
221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch
• eMMC5. compliant
(Backward compatible to eMMC4.5)
• Bus mode
Data bus widths of one bit, four bits, and eight bits –
• Operating voltage range –
Vcc (NAND):3.3V –
Vccq (Controller): 1.8V / 3.3V
Clock frequency: Up to 2133MHz
• Operational temperature (-25°C +85°C)
non-operational storage (-40°C +85°C)
• Others –
This product is RoHS compliant.
• Supported features
• HPI, BKOPS
• Packed CMD, Cache
• Partitioning, RPMB
• Discard, Trim, Erase, Sanitize
• Write protect, Lock / Unlock
• PON, Sleep / Awake
• Reliable write
• Boot feature, Boot partition
• HW / SW Reset - Field firmware update
• Report on Health (SMART)
• Production state awareness
• Type of secure removal
Longsys embedded storage team's "Star" series products are MCP series that can make mobile terminals more intelligent, integrated, and energy-saving. It is a storage combination that stacks DRAM and NAND into a single package and intelligently blends an eMMC/UFS and LPDDR3/4x composite product. It can now give a maximum storage capacity of 128GB+32GB, allowing intelligent mobile terminals to be very productive.
Longsys' embedded storage team has a big input and output in global markets in addition to the domestic market. FORESEE eMCP and uMCP are currently widely utilized in smart mobile terminals in Europe, America, Asia, and Africa, as well as other nations and regions with varying market positions.
PCB Design Optimization
victory at the starting line
The apparent benefit of MCP series storage devices is the two-in-one multi-chip stacking packaging, which may simplify wiring at the source of the circuit design, freeing up circuit layout space for other motherboard components, allowing for more flexible system design, and also favorable to The terminal manufacturer optimizes the BOM list, shortens the delivery cycle, and guarantees that the sales volume and quality are accurate during the manufacturing and sales processes.
Self-created firmware application
Improve data security
Longsys has its own technical R&D team that creates all firmware programs independently and supports software and hardware modification.
Acceleration of FBA free blocks
When enough free blocks are available, data is written to them in pSLC mode, which can increase immediate write speed.
Before the data becomes corrupt, data replacement is carried out. The stability of data storage can be increased by moving and rewriting the storage data when it is determined that the data is going to be destroyed.
Protection against sudden power loss
To prevent losing user data, the primary control foresees low-voltage behavior and stops Flash activity.
Management of global wear-leveling
To extend the life of the product, it may dynamically modify the global wear while avoiding anomalous wear of the local block by keeping track of the Flash Block's wear times.
Algorithm for LDPC error correction
The data may be retrieved in the setting of severe temperature by utilizing the LDPC error correction technique, and the data storage capacity is increased.
The eMCP/UFS firmware may be upgraded over the common eMCP/UFS interface to improve the maintenance of the product life cycle.
Smart mobile terminal devices have been quickly iterated in recent years. Using cellphones as an example, customers want numerous characteristics such as novel shapes, convenience, huge capacity, and high performance, causing terminal makers' memory demands to shift. At the same time, more advances in the integration of flash memory chips are required. This is a stacked package storage product as well. One of the reasons why the market prefers it.
Longsys' embedded storage team has also worked hard to develop new products. FORESEE ePOP, FORESEE Subize eMMC, and other products may be customized to provide precise storage solutions for specific market segments, as well as fulfill the steady and dependable product supply requirements of various smart terminal firms worldwide.
Next Advanced eMMC with a smaller size and reduced power consumption 2022.07.19