Based on the data released by the Ministry of Industry and Information Technology recently, China created 134,000 5G base stations and the number of 5G mobile users increased by 48.11 million in 2022 Q1, with 403 million users in total.
With the popularization of 5G technologies, the functions of smart mobile terminals, both entry-level devices and flagship devices, have improved increasingly, including high-quality photography, 4K video recording, and competitive gaming. These mobile terminals can even compete with specialized devices such as cameras, streaming devices, and computers. The improvement owes to the high-performance flash chips embedded in the mobile terminals.
The Longsys embedded storage team developed the Multiple Chip Package (MCP) series of products that makes mobile terminals smarter, more integrated, and more energy-efficient. The MCP series of products of the industry storage brand FORESEE are categorized into eMCP and uMCP. They are storage combinations that stack and package DRAM and NAND and integrate eMMC/UFS and LPDDR3/4x. At present, the maximum storage capacity is 128GB + 32Gb, which empowers high productivity for smart mobile terminals.
In addition to the storage market in China, the Longsys embedded storage team also invests greatly in overseas markets. At present, FORESEE eMCP/uMCP products are widely applied to the smart mobile terminals in European, American, Asian and African countries and regions and cover different consumer groups.
(MCP products are applied in the global market)
Optimal PCB Design
Enables You to Win at the Start Line
MCP is remarkable for its 2-in-1 multichip stacking and packaging technology, which allows wiring simplification from circuitry design and saves space to implement flexible system design of other parts on the PCB. The technology also does terminal vendors a favor to optimize their BOM, shorten the delivery period, and ensure sales and quality in the production-to-sales process.
(Stacking and packaging is the market trend)
Strengthen Data Security
All firmware is independently developed by the R&D team of Longsys. Software and hardware can be customized.
◆Free Block Acceleration (FBA)
When there are sufficient free blocks, data is written into them in pSLC mode to improve the instantaneous write performance.
Data will be replaced before errors occur. Before data is damaged, it is migrated and rewritten to improve data storage stability.
◆Emergency power failure protection
Low voltage is detected by the master control. In this case, operation on the flash is stopped to avoid loss of user data.
◆Global wear balance management
The wear times of the flash blocks are monitored so that global wear can be adjusted in real time to avoid exceptions caused by wearing in local blocks and improve product service life.
◆ LDPC ECC algorithm
The LDPC ECC algorithm is used to implement data recovery from the storage at extreme temperatures and improve data storage capability.
◆FFU upgrade support
The eMMC/UFS firmware is upgraded through the standard eMMC/UFS interface to strengthen the maintenance of the product in its lifecycle.
(Longsys developed firmware)
SLT Chip Test Capability
Meets Quality Requirements
FORESEE MCP adopts the SLT chip testing solution developed by Longsys, which allows simultaneous large-scale testing of eMMC (FT, RDT) and LPDDR in a product. A station is available for automatic batch testing and the self-developed testing program can test 256 or more chips simultaneously to ensure product quality.
(Test Automation Station)
In the past few years, smart mobile terminals developed rapidly. Smartphone users require new forms, portability, large memory, and high performance, which also improves terminal vendors' requirements for storage. Foldable smartphones use flexible printed circuits (FPCs). The smaller and thinner FPCs require a more flexible wiring design and higher integration with flash chips. FPCs are one of the reasons that make stacked package storage products favored in the market.
Longsys's embedded storage team has also made great efforts in innovating forms. FORESEE ePOP, FORESEE Subsize eMMC and other products can be customized for specific user groups in the market, ensuring the stable and reliable product supply of many smart terminal vendors around the world.