About Longsys

1999

Longsys was established and engaged in mask ROM services.

2002

Developed the world's first USB control chip based on AG-AND flash memory and provided highly compatible and cost-effective storage solutions in China.

2005

Developed, produced, and sold SD cards and MMCs.

2007

Passed ISO9001:2000 quality system certification. Obtained the qualification of "IC design enterprise" by the MIIT.

2008

Produced the world's first USB flash module UDP, changing the production and business models of the USB flash memory industry.

2009

Developed the world's minimal NBOX multimedia player. Became the first enterprise in China who used TLC NAND Flash to produce storage products.

2010

Developed the world's first embedded storage product with USB protocol that uses the 16-layer stacking technology in production of 32GB microSDs.

2011

Created the high-end embedded storage brand FORESEE and released eMMC and SSD storage products. Obtained technical authorization from Oracle and created the Oracle ERP system suitable for the storage market, promoting digital operations of Longsys.

2012

Released the world's first TSOP 48 packaged SD protocol product and obtained the certification of "National Key New Product" from Ministry of Science and Technology.

2014

Used the English name "Longsys" and started global development.

2015

Obtained the qualification of "designated production unit for commercial encryption products. Commodified the DRAM technology and launched LPDDR3 and eMCP embedded storage products.

2016

Developed the first integrated SSD module product SATA disk in package (SDP), motivating industrial innovation. Entrusted Ernst & Young as its auditor for compliance management based on international standards.

2017

Acquired Lexar, a global leading flash memory brand. Lexar became a wholly owned and independent subsidiary of Longsys. Obtained the Chinese Patent Excellence Award. Passed IPR management system certification. Released SLC NAND, nMCP, and other FORESEE micro storage products.

2018

Changed the company name to Shenzhen Longsys Electronics Co. Ltd on September 30 after being approved by the Market and Quality Supervision Committee of Shenzhen Municipality. Released the world's first 1TB UFS, 1TB microSD card, and 1TB PCIe BGA SSD, leading the storage industry to enter the TB-level capacity era.

2019

Completed the first phase of Longsys Zhongshan Storage Industrial Park.

2020

Entered the memory module market and provided consumer-grade, commercial-grade, and enterprise-grade memory products. Established the Shanghai R&D Center and planned to establish the storage innovation base in Lingang Special Area of China (Shanghai). Obtained the sales volume of US$1 billion.

2021

Released DDR5 U-DIMM Memory Module.
Commenced officially the construction of Longsys Shanghai headquarters in Lin-gang Special Area of China (Shanghai) Pilot Free Trade Zone on November 15 (the headquarters is expected to open in 2024).

2022

Started to list on the Shenzhen Stock Exchange (301308.SZ) on August 5.
Launched the first automotive UFS and 512Mb SPI NAND Flash in mainland China.
Released enterprise SSD, taking the first step in the field of high-end storage products.