Many high-tech systems demand higher-density storage solutions and these days many solutions are there in the market to provide the storage demands of these systems. Out of many storage solutions, NAND memory solutions are considered superior for providing. NAND flash memory becomes a mandatory part of many smart systems . NAND-based flash memory has grown into three versions such as MCP, POP, high-density cards, etc.
Now, systems are getting shrink yet they are providing efficient performance, also manufacturers are trying to launch PC that uses less PCB space by utilizing small size highly-effective electronic components. So, the market needs for higher-density storage are very high and memory manufacturers must provide a solution that utilizes less PCB space. Luckily, many companies including Longsys introduced multiple chip packaging to cope with the challenges of efficiency, durability, permanence, and higher capacity needs.
MCP refers to multiple chip packages that came into the market to serve the storage industry with multiple memory facilities. It is comprised of two or more chips packed into a BGA packaging. About 65% of the PCB space is saved by this chip design thus simplifying the design of a system. The MCP memory solutions come in two versions one is NOR-based and the other is NAND-based.
This chip provides much faster read/write performance and has 15 times more endurance than NOR-based solutions. The main objective of NAND-based MCP chips is to integrate high-volume chips into a small package. With significant efforts, manufacturing companies have gifted the market with higher densities of NAND chips of 1mm thickness only. Therefore, this chip is becoming a vital part of advanced electronics systems to handle the functioning and growing needs of data storage.
FORESEE is committed to launching cutting-edge storage products to meet the memory requirement for a better future. To gain more advantages, FORESEE is engaged in introducing power-efficient electronics products such as multi-chip packages. This NAND-based chip is designed to power up the IoT and wearable systems.
In the year 2019, the continuous effort of FORESEE has gifted the industry with reliable NAND-based MCP product lines. Till now, it comes in many capacity versions such as 1Gb+1Gb. The NAND memory and DRAM are integrated into a single BGA package, thus simplifying the structure of PCB. All these solutions are miniature and provide up to 40-50% PCB space-saving facility. Low voltage utilization is its next competitive advantage, consuming only 1.8 volts of power. These cutting-edge chips come in several versions and packaging designs to meet the needs of every system. The integration of DDR and NAND memory into a single chip promote the use of less number of components thus reducing the cost as well as space of a system.
All our solutions satisfy the needs of small-sized storage solutions of many customers, providing exceptional working and stability. Furthermore, each item is packed with error correction code technology and has superior wear leveling and poor block handling. FORESEE innovatively designed each solution to meet the industrial-grade rough environment demands, offering high-speed performance, scalability, and consistency.
· All the FORESEE NAND-based MCP solutions come in the size of 8*10.5*1.0 mm.
· To meet the demand of each customer, this product line has operational temperature ranges from -40°C to 85°C
· Utilizing the BGA 162 package interface.
· Provides power efficiency by consuming power of 1.2V to 1.8V.
To provide reliable versions of solutions, each FORESEE solution passed through a series of durability tests such as performance tests, rough environment tests, etc, just to ensure the product’s stability and compatibility. Our solutions are serving a wide range of industrial applications and we are dedicated to providing customers with memory solutions that are beyond expectations
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