2025.03.11
On March 12, MemoryS 2025 grandly opened in Shenzhen, bringing together top experts, industry leaders, and technology pioneers in the storage sector to discuss the future of storage technology and its innovative applications in business. Hua-Bo Cai, Chairman and General Manager of Longsys, was invited to attend and delivered a keynote speech titled “Memory Business · Comprehensive Innovation,” sharing insights into the company’s innovative memory business model and integrated service capabilities.
Exploring a Comprehensive and Innovative Memory Business Model
In his speech, Hua-Bo Cai emphasized that Longsys, as a branded semiconductor memory enterprise, is continuously exploring innovative business models that align with industry trends while addressing market and customer pain points. To achieve this, Longsys has built an integrated memory service ecosystem centered on:
• In-house memory controllers to enhance product differentiation
• Longforce Suzhou ESAT (Enterprise Semiconductor Assembly and Testing) for customized packaging and testing manufacturing
• Zilia’s storage product manufacturing and Lexar’s global branding and distribution
Expanding the In-house Controller Matrix, Embracing Innovation for Breakthroughs
With a comprehensive and specialized semiconductor team, Longsys has rapidly expanded its in-house memory controller lineup. From eMMC and SD controllers in 2024 to the launch of UFS and USB controllers in 2025, the company continues to innovate, ensuring proprietary core IP development for improved performance and storage solutions.
UFS 4.1: In-house Memory Controller for Peak Performance
• WM7400 in-house controller | Supports TLC and QLC
• 4,350MB/s sequential read | 750K IOPS random write | Up to 2TB capacity
Powered by the in-house WM7400 controller, Longsys has introduced UFS 4.1, leveraging advanced foundry processes and 3rd Gen. Prime LDPC technology to enhance reliability. Supporting both TLC and QLC NAND Flash, this product features a high-performance architecture with superior power efficiency and standby consumption. With sequential read speeds of 4,350MB/s and random IOPS reaching 750K/630K, it outperforms industry peers and is ideal for AI smartphones, tablets, smart vehicles, and humanoid robots, enabling real-time decision-making and seamless user experiences. The product has already completed compatibility tests on multiple mainstream platforms.
eMMC Ultra: Breaking Performance Barriers
• WM6000 in-house controller | High-speed protocol design | 600MB/s theoretical speed
• Surpassing eMMC 5.1 | Performance comparable to UFS 2.2 (64GB)
As a widely used storage product, eMMC has undergone a technological breakthrough at Longsys. eMMC Ultra, built on a high-speed protocol design with the WM6000 in-house controller, surpasses eMMC 5.1 standards, boosting bandwidth by 50% with a theoretical speed of 600MB/s. Its sequential and random read/write performance is on par with UFS 2.2 (64GB), delivering cost-effective and smooth user experiences for smartphones and other devices.
Automotive-grade Storage: Comprehensive Product Portfolio
• Automotive UFS: In-house controller | In-house packaging & testing | 64GB–256GB | Grade 2
• Automotive eMMC: In-hosue controller | In-house packaging & testing | 4GB–128GB | Grade 2/3
• Automotive LPDDR4x: High-performance | Low-power | 2GB–8GB | Grade 2
• Automotive SPI NAND Flash: In-house Flash | 1Gb–4Gb | Grade 2
Longsys has developed a comprehensive automotive-grade storage portfolio that meets AEC-Q100 reliability standards, forming a dual-wheel drive system of Flash + DRAM. With in-house developed controllers and innovative packaging technologies, Longsys’ automotive storage solutions support customization needs for automakers.
Through the Product Technology Manufacturing(PTM) business model, Longsys offers innovative customized services that energize the automotive storage market, expanding applications in ADAS, smart cockpits, and over 10 in-car scenarios. In 2024, the market grew by nearly 100%, with 20+ automakers and 50+ Tier 1 suppliers forming deep partnerships. The company has also passed compatibility tests with over 20 major chipset platforms.
Enterprise-grade Storage: Comprehensive AI-Optimized Solutions
• PCIe eSSD: 1.6TB–7.68TB | 1-3 DWPD
• SATA eSSD: 480GB–3.84TB | 1-3 DWPD
• MRDIMM: 128GB–256GB | Up to 8800MT/s | DDR5 plug-and-play
• RDIMM: 32GB–128GB | Up to 6400MT/s
Longsys has made significant strides in enterprise storage, developing a full range of enterprise solutions, including MRDIMM, PCIe eSSD, SATA eSSD, and RDIMM. Addressing AI-driven demand, Longsys provides full-stack customization, covering specifications, firmware, hardware, advanced testing, and production.
For high-quality deliveries, Longsys has built a dedicated data center production line, integrating high-end equipment and digital systems to ensure full-stack traceability, high reliability, and consistency for data centers and AI servers.
Global Expansion and Brand Development
Mr. Cai elaborated on Longsys memory globalization services in his speech. Through a series of strategic acquisitions and global expansion, the company has successfully established a comprehensive international service system spanning R&D, production, and sales.
Zilia Technologies: Strengthening Europeans American Storage Manufacturing
Longsys’ Brazilian expansion is a key part of its global strategy. Zilia, with 27 years of local manufacturing experience, is South America’s largest storage manufacturer. Since being acquired, Zilia launched Longsys’ production line in 2024, enabling localized storage manufacturing in the Americas while integrating global supply chain resources. Benefiting from tariff policies, Zilia strengthens Longsys’ services in Europe and the Americas.
Lexar: Global Branding and Channel Expansion
Lexar, Longsys’ high-end consumer storage brand, operates in 70+ countries across six continents, with leading retail and authorized partners. Under Longsys’ support, Lexar has expanded its product portfolio, leveraging full-category storage solutions. The brand has seen 67% of revenue from Europe and America, with over 50% CAGR in global sales over the past three years, demonstrating strong market growth and brand influence.
TCM / PTM Business Model: Reshaping the Memory Industry
The rapid adoption of AI and continuous technological iterations are reshaping industry trends, while homogenization in application scenarios and product design bottlenecks have emerged as critical challenges. This drives the storage industry to accelerate its transformation and upgrading to meet growing market demands for unique and customized storage solutions. In response, Longsys has developed an open business model, sharing core capabilities with partners, engaging in deep collaboration and complementary advantages with industry players, fostering joint innovation to pioneer a new paradigm in memory commerce.
TCM Business Model: Optimizing Supply Chains
The Technology Contract Manufacturing(TCM) business model integrates the upstream and downstream supply chain to establish a shorter, more efficient link between manufacturers and Tier 1 customers, reducing costs, improving inventory management, and ensuring transparent transactions and stable supply.
PTM Business Model
The Product Technology Manufacturing(PTM) business model acts as a storage foundry, providing end-to-end services in chip design, firmware, hardware, packaging, testing, and production. This model tackles industry-wide standardization challenges and has been adopted across automotive, server, industrial, and consumer electronics sectors.
Longforce Suzhou Becomes the Packaging and Testing Hub for TCM & PTM
Through continuous development, Longforce Suzhou has adopted the ESAT (Enterprise Semiconductor Assembly and Testing) model, providing dedicated packaging and testing services tailored for specific products and production lines. It has now become
the packaging and testing hub for Longsys’ TCM and PTM business models.As a high-end packaging and testing facility under Longsys, Longforce Suzhou focuses on serving Tier 1 brand customers worldwide, offering value-added customization services with
dedicated production lines for industrial and automotive-grade storage. Additionally, it serves as a manufacturing base for multi-chip storage solutions such as uMCP, ePoP, and MCP, supporting integrated R&D and production while also empowering Zilia’s
manufacturing operations.With the ESAT model, Longsys has made significant advancements in packaging technology, achieving smaller form factors for UFS 4.1 and LPDDR5x 496Ball. Recent innovations include the 0.6mm ultra-thin ePOP4x and 7.2mm × 7.2mm ultra-compact eMMC for wearable devices, setting new benchmarks in size and thickness reduction.
Looking Ahead
The open-source storage business model and comprehensive innovation services showcased at MemoryS 2025 highlight Longsys’ strategic transformation into a branded semiconductor memory enterprise. Moving forward, Longsys will continue driving business model upgrades, accelerating product commercialization, and strengthening global brand influence, fostering new opportunities in the memory industry.
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E-mail:marcom@longsys.com