As electronic devices have increasing rigorous requirements for the hardware size and space, miniaturized storage is required. Memory cards are also move towards small size, large capacity, and high performance.
Memory cards first are CF and SD cards used in cameras and now are microSD cards used in smartphones. microSD cards have become the mainstream external memory cards. However, to use microSD cards, terminal product manufacturers need to pay 6% SD card and CPRM patent fees to SD-3C. The high cost keeps a great many terminal product manufacturers away. In addition, microSD card slots are gradually removed due to the dimensions restrictions and requirements on smartphones.
In 2018, Chinese smartphone manufacturers launched innovative Chinese standard memory cards based on the NANO SIM card specifications. The capacity increased from 64 GB to 256 GB. These memory cards focused on extended storage of high-end smartphones.
Miniaturized memory card Evolution. Innovative Chinese standard memory cards represent the mainstream memory card specifications in the future
As a high-end consumer storage brand of Longsys, Lexar invests heavily in R&D and innovation by leveraging Longsys products and technical advantages.
On March 2 this year, Lexar launched a brand-new memory card nCARD. nCARD specializes in mobile phone storage in the 5G era, meets capacity and performance requirements, and solves myriad challenges to storage capacity expansion of mobile phones in the future.
Efficient and large-capacity storage expert
Compared with microSD cards, Lexar nCARD reduced 45% volume in the identical size and can share the card slot with the NANO SIM card.
nCARD has a read speed of up to 90 Mbit/s and a write speed of up to 70 Mbit/s. The high IOPS response ensures smoother operation of mobile phones. Available storage capacity types include 64 GB, 128 GB, and 256 GB, which meet different market demands.
Lexar nCARD used on smartphones
Longsys solves technical difficulties and takes the lead to apply YMTC Xtacking® technical products to the new-generation memory cards. Longsys incorporates the YMTC 64-layer 3D NAND into Lexar nCARD products to promote marketization of the next-generation storage terminal medium and jointly build the storage ecosystem.
nCARD has passed performance and quality tests and is ready for mass production.
YMTC 64-layer 256 GB 3D NAND packaged in nCARD
YMTC released two 128-layer 3D NAND products based on the Xtacking® 2.0 architecture on April 13, that is, 1.33 TB QLC 3D NAND flash memory and 512 GB TLC 3D NAND flash memory. The QLC 3D NAND flash memory is the first NAND flash memory with a single die capacity of 1.33 TB. It outperforms main competitors in terms of capacity and performance.
As the first 128-layer QLC flash memory in the industry, YMTC QLC 3D NAND flash memory also sets three records, that is, the highest unit density in the industry, the highest single-chip capacity of 1.33 TB, and the fastest I/O speed of 1.6 Gbit/s.
Schematic diagram of YMTC Xtacking®
YMTC 128-layer 512 GB TLC 3D NAND flash memory also supports Lexar nCARD products. Thanks to the 16-die high-stack process, the capacity will reach 1 TB the next year, which meets the conditions for storage terminal medium.
Grace, Senior Vice President of Marketing and Sales of YMTC, said: "As a newcomer in the flash memory sector, YMTC saw a quantum leap from 32 to 64 and 128 layers in merely three years. This is the result of YMTC employees' concerted efforts and the achievement of collaboration between upstream and downstream manufacturers in the global industrial chain. As the Xtacking® 2.0 era dawns, YMTC has the resolution, strength, and capability to build a new business ecosystem."
Latest YMTC 128-layer 3D NAND product
Mr. Huabo. Cai, Chairman of Longsys, said: "I believe that through close cooperation with YMTC, Longsys can mass-produce products of 1 TB capacity in the first half of next year. The TB era for mobile phone memory cards will arrive soon. We will see more possibilities in size, read and write speeds, and security. Longsys and industry partners jointly build a new storage ecosystem to promote marketization of new-generation storage terminal medium."
nCARD can become an embedded storage medium with the nCARD card slot and eMMC protocol
Yangtze Memory Technologies Co., Ltd. (YMTC) was founded in July 2016 and is headquartered in Wuhan.
In October 2017, YMTC designed and produced China's first 3D NAND MLC flash memory through independent R&D and international cooperation.
In September 2019, the 64-layer TLC 3D NAND flash memory based on YMTC's innovative Xtacking® architecture was mass-produced.
On April 13, 2020, YMTC released the Xtacking® 2.0 architecture and 128-layer QLC and TLC products.
Shenzhen Longsys Electronics Co., Ltd. (hereinafter Longsys) was founded in 1999 and is headquartered in Shenzhen.
Longsys created FORESEE, an embedded storage brand for industry applications, in 2010, and acquired Lexar, an American high-end consumer storage brand, in 2017.
Since then, Longsys officially evolved from a technical product company to a technical brand company, and continues to provide stellar, high-performance innovative storage products for users worldwide.