Longsys Launches Industry’s First Integrated-packaging mSSD, Delivering Flexible and Efficient Manufacturing with the “Office is Factory” Model

October 20 — Shenzhen, China — Longsys has announced the launch of the industry’s first integrated-packaging mSSD (Micro SSD), developed under its innovative “Office is Factory” manufacturing concept. By redefining the form and function of conventional SSD media, this new product category combines high quality, high efficiency, low cost, and flexible manufacturing, bringing new possibilities to commercial SSD applications while enhancing user participation and creative experience.

The mSSD has completed development and testing phases, with related domestic and international patents filed. It is now ramping up for mass production.

Integrated SiP Design: Chip-Level Quality

The Longsys mSSD adopts wafer-level system-in-package (SiP) technology, integrating the controller, NAND Flash, PMIC, and passive components (resistors, capacitors, etc.) into a single package. This approach establishes electrical interconnections, mechanical protection, and efficient thermal management within one compact form.

By eliminating nearly 1,000 solder joints found in traditional PCBA SSDs, the SiP architecture mitigates potential reliability issues such as solder contamination, component interference, and degradation caused by high temperature, humidity, or corrosion. It is especially suitable for compact form factors such as M.2 2242 and M.2 2230.

With this design, mSSD elevates SSD reliability from PCBA level to chip-level quality, reducing DPPM (Defective Parts Per Million) from ≤1000 to ≤100, and delivering a significant improvement in overall quality and durability.

Streamlined Production: Higher Efficiency, Lower Cost

The mSSD dramatically simplifies the complex manufacturing process of conventional PCBA SSDs.

Unlike traditional methods, where wafers must be separately packaged and tested for NAND, controllers, and PMICs before being transferred to SMT facilities for surface mounting, the mSSD integrates all steps into a single packaging process — eliminating PCB mounting, reflow soldering, and multiple logistics transfers.

This design doubles overall delivery efficiency while reducing incremental manufacturing cost by more than 10%, creating a highly competitive cost structure.

For customers with strong sustainability requirements, the mSSD also avoids high-energy SMT procedures, significantly lowering power consumption and carbon emissions during production — enabling greener, more sustainable manufacturing.

Superior Thermal Design: Sustained Peak Performance

Despite its ultra-compact size (20 × 30 × 2.0 mm, 2.2g), the mSSD meets PCIe Gen4×4 performance standards through optimized architecture and thermal control.

Real-world tests show:

         •       Sequential read speed up to 7400 MB/s

         •       Sequential write speed up to 6500 MB/s

         •       4K random read up to 1000K IOPS

         •       4K random write up to 820K IOPS

The product employs a high-conductivity aluminum alloy frame, graphene thermal layer, and high-performance thermal silicone for enhanced heat dissipation. This allows the mSSD to maintain peak performance for extended periods — ideal for high-load applications such as AI PCs, gaming handhelds, drones, and VR devices. 

Its power efficiency also meets the NVMe L1.2 standard (≤3.5 mW), with peak power consumption fully compliant with NVMe protocol requirements.

This innovative thermal solution lays a solid foundation for the next generation of PCIe Gen5 mSSD products.

Flexible Expansion: Multiple SKUs in One

While innovating in structure, the mSSD also ensures broad client compatibility. It supports TLC and QLC NAND Flash configurations, with capacity options ranging from 512 GB to 4 TB.

An optional clip-on thermal expansion card allows tool-free conversion between mainstream form factors such as M.2 2230, 2242, and 2280, enabling multiple SKUs in one and providing flexible adaptation to various application needs.

Compared to conventional SSD solutions that face challenges like non-standard interfaces, limited compatibility, or difficult maintenance for on-board designs, the integrated mSSD offers easier installation, replacement, and lower maintenance costs, catering to diverse modern storage demands.

After delivery, customers can also perform on-site customization using inkjet or UV printing to apply branding or personalized designs — achieving real-time assembly and retail packaging directly in office environments, bringing the “Office is Factory” concept into practical realization.

Empowering Innovation Through Co-Creation

With its integrated SiP design and flexible manufacturing model, the Longsys mSSD is set to empower both industrial and consumer storage brands. It meets market needs for fast customization, reliable quality, compact delivery, and cost efficiency, helping brands develop differentiated products and respond quickly to evolving market trends.

As Longsys continues to advance its packaging and manufacturing technologies, the company remains committed to driving innovation in the global storage industry and extending its solutions to even broader application scenarios.