FORESEE, Longsys's Storage Brand, Launches a Variety of Small-sized Memory Chips to Enable Powerful Features for Smart Wearables

Recently, metaverses have become a hit and are highly sought after by tech giants. However, their frames are still being constructed. The rise of such worlds is inevitable when 5G communication, Internet of Things, cloud computing, artificial intelligence, big data, AR/VR wearables, and other underlying technologies are becoming increasingly mature. How to virtualize people in the construction process will be the key to unlocking metaverses. The key is what we now know as smart wearables.

Although smart wearable technology is not strong enough to build metaverses for the moment, smart wearable applications, as important application scenarios of the Internet of Things, do demonstrate unstoppable momentum. According to data found on www.askci.com, the size of the wearables market in China has maintained a growing trend, growing from CNY 21.26 billion in 2017 to CNY 55.92 billion in 2020, which represents an average annual compound growth rate of 38.04%. It is expected that the size of this segment will reach CNY 96.42 billion in 2022.

Smart Wearables Advance Irresistibly

The Application Market Is Upgrading Rapidly

Smart wearables, which are wearable devices with smart capabilities, can allow people to better perceive themselves and external information. Wearable motion sensors, smart watches with health data management devices, and other devices for the sports, fitness, and healthcare domains are the most common equipment for perceiving information about the wearers. For devices designed to perceive external information, they are applied in a wide range of fields including leisure and entertainment, information exchange, and industrial applications. VR game suits with gamepads and visual capture modules, smart glasses that can perform visual and audio interactions, and the “thermometer under the arm” used in the 2022 Winter Olympics all fall into this category.

With the user population continuing to expand, such products are becoming diversified in terms of forms as they rapidly develop toward intelligentization and miniaturization. Therefore, memory chips featuring advanced process technology, smaller size, and lower power consumption are extremely important for wearables.

Case Study

Smart wearables often need to stay in standby mode for a few weeks or even a month. Wearable devices used for disease treatment, rehabilitation monitoring and other healthcare purposes need to have a long battery life, sustain uninterrupted operation, and be equipped with various monitoring sensors on their tiny PCBs to save the user's physical indicators in real time, so that doctors can dynamically control the patient's conditions. In addition, such equipment need to store physical sign data in a reliable and stable manner as they have important reference value for disease treatment. This is where the power consumption, volume, and performance of memory come into play. We can comprehensively improve the market competitiveness of smart wearables if we give them a long battery life and the capability to store instantly when reducing their size without reducing their performance.

High-performance, small-sized, and low-power memory chips are ideal choices for such devices as they can effectively help smart watches accurately and stably collect, store, and convert large amounts of data for a long time.

Pain Points in Storage Modules of Smart Wearables

Opportunities and Challenges

01 Limited physical space

The storage modules of smart wearables need to stay small and compact. LED displays, memory, various sensors, Bluetooth chips, and batteries must be accommodated in an extremely limited physical space.

02 Short battery life

Such products often need to operate in a power-saving mode as battery capacity is limited. As one of the important components for such devices, memory needs to ensure that data can be written and erased repeatedly with low power consumption.

03 Stability and reliability requirements

Water resistance, shock resistance, and other features are especially important for smart wearables, especially health monitoring devices. Memory needs to adapt to various environments and ensure data writing stability and storage reliability under high temperature, wet conditions, impact and other damages, as well as long periods of operation.

04 High performance requirements

More and more features are integrated on such devices while their sizes are getting smaller and smaller. Ensuring both a low power consumption and a high sensitivity for memory has become a major challenge for the storage modules of smart wearables.

05 Data security

Most smart wearable products store a large amount of data indicators. Users' personal health and safety may be exploited by criminals when physiological data about their heart rate, heartbeat, exercise, sleep state, and other aspects are stolen. Therefore, the storage industry also needs to continuously improve the data encryption capabilities of products to avoid data leakage and other security problems as much as possible.

The Right Solution

Can Boost Smart Wearables Dramatically

Actively responding to the customization needs, as well as the intelligentization and miniaturization development trends of the smart wearables market, Longsys has developed several small-sized and high-performance memory chips to further improve its product competitiveness.

ePOP3

Capacity options: 8GB+4Gb/8GB+8Gb

Operating temperature: -25℃ – 85℃

Dimensions: 10 × 10 × 0.9mm

Integrating eMMC and LPDDR into the same package and leveraging a low-power consumption mode, which can reduce the power consumption by up to 30% than that of the normal mode, ePOP3 now is able to effectively improve the battery life of terminal devices.

Subsize eMMC

Capacity options: 4GB/8GB/32GB

Operating temperature: -25℃ – 85℃

Dimensions: 9 × 7.5 × 0.8mm/9 × 10 × 0.8 mm/10 × 10 × 0.8mm

Taking the JEDEC pin standards into account, this innovative eMMC product features a smaller size and less PCB space, making it suitable for smart watches, wireless earbuds, and other application scenarios where space is very limited.

NAND-based MCP

Capacity options: 1Gb+1Gb/4Gb+2Gb

Operating temperature: -40℃ – 85℃

Dimensions: 8 × 10.5 × 1.0mm/8 × 10.5 × 1.0mm

NAND-based MCP packages flash memory and LPDDR in a single package to simplify the design and save space. The core voltage of 1.8V can meet the low power consumption requirements of wearable devices and the Internet of Things.

Longsys Innovates Proactively to Drive Transformation

And Become a Brave Pioneer in Making Scientific and Technological Innovations

Longsys always takes product and technology innovation as its core driving force behind transformation and upgrades.

1) It boasts independent and autonomous firmware development and continuous innovation capabilities. Longsys has innovated multiple firmware algorithms. Its independently developed firmware covers all product lines, which has enhanced its market competitiveness. In addition, Longsys uses firmware innovation to accelerate product customization, providing storage products with specific attributes and various specifications for certain industries, customers, and application scenarios.

▲ Longsys Innovation Lab

2) It boasts leading SiP integrated packaging design capabilities. Longsys continues to improve and innovate on its SiP packaging design capabilities to realize the miniaturization, modularization, and multi-functionalization of ePOP3, a composite storage product integrating eMMC and LPDDR, Subsize eMMC, and other storage products.

3) It has developed several innovative memory chip testing algorithms. Longsys also develops testing hardware via independent research and development, cooperative development with third parties, and other routes. Its innovative and customized testing equipment can effectively reduce testing costs while achieving the same testing performance. Using industry-leading testing solutions, it can achieve high-speed, high-frequency, large-scale, and low power-consumption testing of memory chips.

▲T5503HS2ES Testing System