FORESEE Launches First Proprietary PCIe Gen4 BGA SSD, a “Better Solution” for Lightweight Storage

PCIe SSDs have become the mainstream storage solution in the PC OEM market. With PCIe SSD prices decreasing in the past two years, the procurement costs of PC OEMs are also decreasing. Currently, PC storage is shifting to large-capacity and high-performance PCIe 4.0 SSDs, which is causing their market penetration rate to increase significantly.

To embrace the era of PCIe 4.0 and enable a richer product matrix, the FORESEE SSD Team recently launched its first proprietary XP2200 PCIe Gen4 BGA SSD.

Adopting a PCIe Gen4 x2 interface and NVM Express base specification revision 1.4, the new SSD boasts a sequential read/write performance of up to 3,500MB/s and 3,400MB/s, as well as a random read/write performance of up to 678K IOPS and 566K IOPS. It comes in capacities of 128GB, 256GB, 512GB, and 1TB. Mainly used in 2-in-1 computers, ultra-thin notebooks, virtual reality (VR), intelligent vehicles, and in games and entertainment, it supports two working temperature ranges (-25~85°C and 0~70°C), LDPC, intelligent temperature control, and other features

FORESEE XP2200 PCIe Gen4 BGA SSD

Featuring Advanced Process Technology, The Controller Is Specially Designed to Optimize Heat Dissipation

With the increasing urgent needs for integrated storage capacity, the density of chips and components in product packaging continues to increase, and reducing temperature and power consumption has become a difficult problem in the industry. Compared with the M.2 form factor, the BGA package features a more compact wiring design to ensure small size, low power consumption, and high performance. The FORESEE XP2200 PCIe BGA SSD uses a controller with advanced process technology, resulting in excellent energy efficiency.

For heat dissipation, the team conducted special research and adopted advanced heat dissipation materials and an efficient heat dissipation solution for the product. Leveraging thermal simulation calculations and verifying with many other auxiliary technologies, the team has optimized the thermal distribution and conductivity of the chips.

In addition, thermal system control (thermal throttling) and other features and optimizations have been added to the firmware algorithms to balance the heat generated in high-speed read/write operations, effectively controlling the product's temperature, and ensuring long-term stable operation.

New heat dissipation materials and software technologies

Cutting-edge Packaging and Testing Techniques Enable High-rise Stacking Technology

Six years after Longsys debuted the BGA SSD with the smallest size at that time in July 2017, the R&D team continued make great breakthroughs in packaging and testing techniques. With FC, WB, MUF, SDBG, and other industry-leading packaging and testing processes, the FORESEE XP2200 PCIe BGA SSD highly integrates NAND flash, the controller, and electronic components to ensure product performance and to achieve a slim design. The thinness can be adjusted according to the number of stacked layers.

As an example, the thickness of the SSD with a 1TB capacity is only 1.35mm, which is thinner than any other similar mainstream products on the market. Featuring high performance, small size, large capacity, and other advantages, BGA SSD products break the performance bottlenecks of eMMC, extend the application platforms of UFS, and provide a precise storage solution for 2-in-1 computers, ultra-thin notebooks, and other mobile smart devices.

Advance packaging and testing technology

Proprietary Firmware Algorithms For Independent and Controllable Product Solutions

Based on years of technical accumulation and market experience in industry storage, the R&D team has analyzed application scenarios, sudden user demand, data security, product robustness, and other aspects. They anticipate and perceive users' needs for product features, and carry out firmware development accordingly.

In virtue of independent intellectual property rights, the R&D engineers developed and optimized dynamic/static read and write acceleration technology, In-Drive RAIN, low-power L1.2, and other features to achieve the perfect balance for the XP2200 PCIe BGA SSD in performance, safety, reliability, low power consumption (L1.2 < 3.5mW), and other dimensions.

Proprietary firmware algorithms

Unleashing the Full Potential of Gen4 with a 7,000+ MB/s Read Speed

According to the product roadmap, the team expects launch new PCIe Gen4 x4 BGA SSD solutions this year. It is estimated that the read performance will exceed 7,000 MB/s, the size will be 16 × 20mm, and the maximum capacity will be 2TB. Besides, the products also support switching between M.2 2230/2242/2280, PSSD, and many other SSD physical interfaces to adapt to different application scenarios more flexibly and meet the differentiated needs of PC OEM clients.

In the future, FORESEE will continue to innovate and expand small-sized and large-capacity storage products, and launch more storage solutions that meet market expectations.