Mini SDP

Application:

laptop、computer、pad

Applications
Product Details

特性:

  1. 一体化封装,尺寸仅为33.4mm×17.mm×1.23mm

  2. 低功耗:1430mW

  3. 重量:1.9g




Specifications
Product   Series 
Interface
Form Factor  
Density 
NAND Flash  
Operating   Temperature
Seq   Read/Write(MB/s)
IOPS   Read/Write(K) 

SATA III 6Gb/sBGA 128GB~512GB3D TLC Flash0-70℃Up to 560MB/s /520MB/sUp to 90K/80K






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