uMCP
uMCP

uMCP

Compound products that combine UFS and LPDDR to save space on PCBs, ensuring compact and lightweight smart devices
Product Advantages

The product simplifies the system's PCB design and reduces occupied PCB space.
Higher performance, larger capacity, and lower power consumption can be achieved in a small package.

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Product Parameter
Product Series Capacity Protocol DRAM Frequency Package Size Operating Temperature Voltage
uMCP 64GB+32Gb UFS 2.2 + LPDDR4x 1866MHz / 2133MHz BGA254 11.5*13*1.0 mm -25℃~85℃ DRAM：VDDQ=0.6V
UFS： VCC : 2.7 - 3.6V ，VCCQ2: 1.7 - 1.95V
uMCP 128GB+32Gb UFS 2.2 + LPDDR4x 1866MHz / 2133MHz BGA254 11.5*13*1.0 mm -25℃~85℃ DRAM：VDDQ=0.6V
UFS： VCC : 2.7 - 3.6V ，VCCQ2: 1.7 - 1.95V
Product Features
  • 01
    The product complies with the latest UFS2.2 standard

  • 02
    The unique data acceleration and recycling technologies ensure system smoothness

  • 03
    Suitable for smartphones and other handheld devices

    The product types include LPDDR3 and LPDDR4x, while their frequencies can reach 800MHz/ 2133MHz respectively. They are widely used in smartphones, tablets, and other terminals.

  • 04
    High performance, low power consumption, and stable quality

    Longsys storage products for smart wearables comply with JEDEC standards, are compact, and feature low power consumption. Longsys utilizes the advanced package process of an international well-known package factory and in-house test technologies to ensure stable and reliable product quality.

Application

  • Smartphones

  • Tablets

Compatible Platforms

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